The numbers listed within the numerous tables are to be used as a guide in determining what the level of producibility is for any feature. The specific requirement for any feature that must be controlled on the end item should be specified on the master drawing of the printed board or the printed board assembly drawing.
Product Types It is important to understand the complex relationship between board types and assembly classifications.
It now includes single-sided, double-sided and multilayer boards made from rigid, flexible, rigid-flex combinations or boards with high-density microvia dielectric material combinations. This guideline recognizes that printed boards and printed board assemblies are subject to classifications by intended end item use and other designations based on assembly characteristics.
Classification of producibility is related to complexity of the design and the precision required to produce the particular printed board or printed board assembly. Any producibility level or producibility design characteristic may be applied to any end-product equipment category.
Therefore, a high-reliability product designated as Class 3 see 1. Printed Circuit Board Assembly Types A type designation signifies further sophistication describing whether components are mounted on one or both sides of the packaging and interconnecting structure.
Type 1 Figure defines an assembly that has components mounted on only one side; Type 2 Figure is an assembly with components on both sides. The need to apply certain design concepts should depend on the complexity and precision required to produce a particular land pattern or printed board structure. Any design class may be applied to any of the end-product equipment categories. Therefore, a moderate complexity Type 1B would define components mounted on one side all surface mounted and, when used in a Class 2 product dedicated service electronics , is referred to as type 1B, Class 2.
The product described as Type 1B, Class 2 might be used in any of the end-use applications with the selection of class being dependent on the requirements of the customers using the application. See Table for description of various board and assembly types. Order of Precedence In the event of any conflict in the development of new designs, the following order of precedence shall prevail: 1.
The procurement contract. The approved master drawing or assembly drawing supplemented by an approved deviation list, if applicable. This standard. Other applicable documents. Presentation All dimensions, tolerances and other forms of measurement temperature, weight, etc. Dimensions and tolerances use millimeters as the main form of dimensional expression; micrometers are used when the precision required makes millimeters too cumbersome.
Celsius is used to express temperature. Weight is expressed in grams. Users are cautioned to employ a single dimensioning system, and not intermix millimeters and inches. Reference information is shown in parentheses. Terms and Definitions The definition of all terms used herein shall be as specified in IPC-T those terms denoted with an asterisk are cited directly from IPC-T , or as listed below: Anisotropic Conductive Contact — An electrical connection using an anisotropic conductive film or paste wherein conductive particles of gold, silver, nickel, solder, etc.
When it is compressed, an electrical connection is attained only in the direction of compression. Axial Lead — Lead wire extending from a component or module body along its longitudinal axis.
Ball Lift — A category of ball bond failure in which the ball lifts from the surface of the integrated circuit die bond pad metallization or lifts the metallization from the surface of the underlying oxide or silicon. Ball Grid Array BGA — A surface mount package wherein the bumps for terminations are formed in a grid on the bottom of a package. The bond wire is melted to form a ball and the ball is bonded by use of thermo-compression or thermosonic techniques. Bonding Time Reflow — The time duration from the commencement of thermode heatup until the reflow thermo profile is completed.
Castellation — A recessed metallized feature on the edge of a leadless chip carrier that is used to interconnect conducting surfaces or planes within or on the chip carrier. Chip Carrier — A low profile, usually square, surfacemount component semiconductor package whose die cavity or die mounting area is a large fraction of the package size and whose external connections are usually on all four sides of the package.
It can be leaded or leadless. Chip Component — A component designed for surface mounting with two or more terminations, attachable with solder or electrically conductive adhesive. The object of this technique is to reduce the thickness of the Chip-On-Board assembly.
A resin may cover the chip after bonding. Chip-On-Board Assembly — A printed board assembly using a combination of uncased chips and other devices.
Conductive Pattern — The configuration or design of the conductive material on a base material. This includes conductors, lands, vias, heatsinks and passive components when these are an integral part of the printed board manufacturing process. Controlled Collapse Bonding CCB — A bonding technique that makes termination by reflowing the solder bump on a chip and connecting it to the land on the printed board.
Component Lead — The solid or stranded wire or formed conductor that extends from a component to serve as a mechanical or electrical connector, or both. Component Pin — A component lead that is not readily formable without being damaged. Coplanarity — The distance in height between the lowest and highest leads, terminations or bumps when the component is in its seating plane. Design for Reliability DfR — Design procedure to assure long-term reliability of electronic assembly.
Die — The uncased and normally leadless form of an electronic component that is active or passive, discrete or integrated. Die Pad — A land on which the integrated circuit die is mounted during the assembly process using adhesives.
Dual-Inline Package DIP — A basically-rectangular component package that has a row of leads extending from each of the longer side of its body that are formed at right angles to a plane that is parallel to the base of its body.
Eyelet — A short metallic tube, the ends of which can be formed outward in order to fasten it within a hole in material such as a printed board.
Part Type Descriptions Component Procurement Delivery System Handling and Storage ESD Protection Chip Resistors Electrical Insulators and Thermal Conductors Basic Construction Termination Materials SOT SOD Pin Numbering Land Patterns Land Patterns for Surface Mount Connectors Land Patterns for Surface Mount Sockets High-Density Printed Board Technology Surface Preparation Temporary Masking Guidelines Gold Thickness Printed Board Condition Assembly Hierarchy Automated Assembly of Surface Mount Connectors Automated Assembly of Surface Mount Sockets Post-Molded Plastic Chip Carriers Component Design for Circuit Boards Design Considerations repeated information Chip Size Standardization Bump Site Standards Peripheral Lead Standards Package Size Standards Body Size Alpha Particle Emissions Soft Errors Shipping Media ESD Footprint Design Design Guide Checklist Die Design Shrinks Printed Board Land Pattern Design High Frequency Performance Thermal Design Handling, Shipping and Storage Handling Systems Storage Atmosphere Types of Carrier Packaging for Shipping Storage System and Length of Storage Mechanical Properties Future Ball Conditions Room Temperature Testing of Wafer vs.
Testing Wafers over Temperature and Costs Characterization and Classes of Flip Chip Joints Manual Techniques for Semiautomated Pick and Place Types of Equipment Single Point Attachment Convection Oven Solder Reflow Vapor Phase Solder Reflow Infrared Solder Reflow Relationships to Test and Quality Assurance Dependence on Printed Board Material Type Dependence on Copper Land and Conductor Layout Dependence on Assembly Structure and Soldering Processes Component Modifications for Surface Mounting Applications Component Orientation for Wave-Solder Applications Conductor Clearance for V-Groove Scoring Breakaway Routed Pattern with Routed Slots Single Inline Packages Component Printed Board Bonded to Supporting Plane Sequentially Processed Structure with Supporting Plane Features Common to 0.
Common Configurations of Rectangular Resistors Horizontal Mounting of Radial Leaded Component Vertical Mounted Radial-Lead Components Vertical Mounted Components Coating Meniscus Radial Components Mounting Unsupported Holes Appropriate Thermal Model for Thermal Paste Approximate Thermal Model for Chip Underfill D-Subminiature Surface Mount Connector Test Probe Feature Distance from Component Packaging and Interconnecting Structure Comparison Interconnect Density Peripheral Vs.
Area Array Automated Soldering Processes Assembly Sequence Global Fiducials Conductor Width and Spacing Via Guidelines Drilled Via Holes Inspect Before Assembly Vias and Land Pattern Separation See Full Reader. Post on Nov views. Category: Documents 40 download. Tags: reect progressive increases interconnecting structure comparison functional constraining cores flip chip joints flatpack outline drawing surface mount sockets surface mount connectors metal support plane.
Approved Schemes for Atletismo IPC Enero IPC Logistiek. IPC Conditions for achieving IPC Class 3! IPC Introduction. Each official is allowed to.
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